Nagaland University discovers plant compound to treat diabetic wounds

New Delhi: Nagaland University researchers have identified a naturally occurring plant compound called "Sinapic acid" as a powerful therapeutic agent capable of significantly accelerating wound healing in diabetic conditions, according to a PTI report.

The discovery marks a major advancement that could result in safe, natural and effective treatments for diabetic wound management, they said.

According to Panav Kumar Prabhakar, Head, Department of Biotechnology, Nagaland University, this is the first study globally to demonstrate that Sinapic acid, when administered orally, can accelerate diabetic wound healing in preclinical models. The research established that the compound works by activating the SIRT1 pathway, which plays a crucial role in tissue repair, angiogenesis and inflammation control.

The findings have been published in Nature Scientific Reports, a peer-reviewed, open-access journal from Nature Portfolio (Springer Nature).

"This discovery not only highlights the strength of our scientific community but also reflects our commitment to addressing pressing health challenges through innovation rooted in nature. I congratulate the research team for their dedication and contribution towards improving healthcare solutions," said Jagadish K Patnaik, Vice Chancellor, Nagaland University.

Prabhakar explained that diabetes mellitus remains one of the world's most pressing chronic diseases, affecting hundreds of millions globally.

"Among its serious complications is delayed wound healing, often resulting in diabetic foot ulcers, infection and in severe cases, amputation. Existing synthetic drugs have shown limited efficacy and often cause undesirable side effects," he said.

"We set out seeking a safe, plant-based alternative — exploring how Sinapic acid, a naturally occurring antioxidant found in various edible plants, could accelerate tissue repair, reduce inflammation, and promote new blood vessel formation in diabetic wounds," he added.